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The International Business Machines Corporation patent solves the following problem:
A wiring design tool that automatically or semi-automatically designed a wiring on a printed circuit substrate or a wiring relationship between the pads on a semiconductor chip and pin (terminal) in a semiconductor package used in some electronic equipment exposed to pupa 5- 143689. a development of wiring route and speed the design disclosed, however, is not determined until the wiring design or not finished wiring on a printed circuit and the same is 100% possible (whether or not a wiring solutions available) by a wiring design apparatus.
Our analysis of this patent is as follows:
International Business Machines Corporation’s patent US 6295634 B1 deals with Wiring design apparatus, wiring determination apparatus and methods thereof.
The present invention relates in general to effectively design a wiring in a semiconductor package, and others, in a short time. A wiring design software (HK) read design information indicating the nature of pads on a chip, disposition of pins in a package, and relationships of correspondence between the pads and the pins, it analyzes Against a wiring problem, put the pads and pins the source and sink elements, and assign a series of numbers to identify the pads and the pins of a same number in recognition assigned to a pad and a pin connected to each other (S102, S108). The wiring design HK a virtual triangular with a source / sink elements as an apex by applying the Delaunay triangulation of the source and sink elements (S110). The wiring design HK levels put the pins in the formed triangle (S200). The wiring design HK determine whether or not an edge of the triangle crosses a wiring and connecting the edges bent over one another to get a route the wiring (S220), outputting the result of wiring design (S118 ).
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